Press Release

Global Die Bonder Equipment Market is Expected to Reach US$ 779.9 million by 2022

Date : Dec 10, 2018

New report published by Global QYResearch which offers insights on the global Die Bonder Equipment market. The Die Bonder Equipment market has been experiencing steady growth graph since past years. During the 2017-2022 timeline, the global market for Die Bonder Equipment is expected to reflect a 0.4x increase in the revenue growth. The global Die Bonder Equipment market is expected to reach $779.9 million by 2022 from $759.6 million in 2017, growing at a CAGR of 0.53% from 2017 to 2022. And Europe market is expected to be the biggest market with output market share of 30.84% in 2022.

Global Die Bonder Equipment Market: Market Driver and Restraint

There are major three classifications of Die Bonder Equipment in this report, Fully Automatic, Semi-Automatic and Manual. In the global market, the output volume share of each type of Die Bonder Equipment is 67.87%, 16.87% and 15.26% in 2016.

The report then focuses on major industry players in Global, including company profiles, product images and specifications, sales, market share, and contact information. More importantly, the Die Bonder Equipment industry development trends and marketing channels were analyzed. Providing the main statistical data on the current status of the industry is a valuable guide and direction for companies and individuals interested in the market.

Global Die Bonder Equipment Market: Key Takeaways

  • The key differentiation strategy is to Upgrading of equipment in semiconductor industry
  • In terms of form, Demand for fully automatic equipment is increasing

Global Die Bonder Equipment Market: Forecast by Nature

The global Die Bonder Equipment market is expected to reach $779.9 million by 2022 from $759.6 million in 2017, growing at a CAGR of 0.53% from 2017 to 2022. And Europe market is expected to be the biggest market with output market share of 30.84% in 2022.

Global Die Bonder Equipment Market: Forecast by Application

Application segment consists of Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Test (OSAT). Die Bonder Equipment finds application as a pigment, which was estimated to account for a revenue share of over 79.5% within the Integrated Device Manufacturers (IDMs) industry segment in 2017. In 2017, the Outsourced Semiconductor Assembly and Test (OSAT) segment was estimated to be valued at US$ 155.9 Mn which is expected to increase at a CAGR of 0.5% over the forecast period.

Global Die Bonder Equipment Market: Forecast by Form

This segment includes Fully Automatic, Semi-Automatic and Manual. In terms of volume, In the global market, the output volume share of each type of Die Bonder Equipment is 67.87%, 16.87% and 15.26% in 2016.

Global Die Bonder Equipment Market: Forecast by Region

Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.

Global Die Bonder Equipment Market: Key Players

Besi, ASM Pacific Technology(ASMPT), Kulicke & Soffa, Palomar Technologies, Shinkawa, DIAS Automation, Toray Engineering, Panasonic, FASFORD TECHNOLOGY, West-Bond, Hybond are the key vendors included in this report.

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